Dr. M. Raj Pulugurtha’s (P. M. Raj) expertise is in the packaging of electronic and bioelectronic systems, power-supply and wireless component integration in flex and rigid packages, and biocompatible and hermetic packaging with high-density feedthroughs. He is an is an Associate Professor at Florida International University. He co-led several technical thrusts in electronic packaging, working with the whole electronic ecosystem, which includes semiconductor, packaging, material, tool, and end-user companies. He is widely recognized for his contributions in electronic hardware integration and technology roadmapping, components for bioelectronic, power and RF modules, and also for promoting the role of nanomaterials and nanostructures for electronics packaging applications, as evident through his several industry partnerships, invited presentations, publications and awards.
Field of Research
Electronic and Bioelectronic Packaging, Flex and 3D packaging with Heterogeneous System Integration for Emerging Biomedical, Communication and Computing systems, Wearable and Implantable Medical Devices, Advanced Passive Components, Vertical Power Delivery, 5G and 6G Systems Packaging, Antenna Sensor Integration, Power and Data Telemetry, Hermetic Packaging, Interconnects and Connectors
His research led to more than 380 publications, which include 110 journal papers, 19 book chapters and 16 articles in widely circulated technology magazines, ~225 conference publications, and 13 patents. His work received more than 35 best-paper awards and other technical achievement awards in various IEEE and other conferences. Many of the research advances from his lab are currently being commercialized by industry partners. He is an Associate Editor for the IEEE CPMT transactions (selected for Best Associate Editor, 2021) and IEEE Nanotechnology magazine, where he created 4 special issues that focused on Nanopackaging (2016, 22021, 2024). Over the past 20 years of his research, he raised more than 14 Million Dollars of R&D funds, mostly from industry. He co-advised or mentored more than 40 MS and PhD students. Many of them are current industry leaders and technology pioneers in the electronic packaging industry, working for Apple Inc, Texas Instruments, Intel Corp., Qualcomm, IBM, Google Inc., Broadcom and other major electronics companies. He offered more than 40 invited (with several keynote and plenary) talks in IEEE conferences, industry advisory board meetings, technical society webinars, and local IEEE Chapter meetings. He is the Co-Chair and former Chair for the Nanopackaging Technical Committee of IEEE Electronic Packaging Society (EPS) and Nanopackaging Technical Council (NTC) since 2014, and the former Chair of ECTC High-Speed Wireless and Components (2017) Technical Committee. He led multiple technology roadmapping activities for Heterogeneous integration (with IEEE EPS) – Power passives components and materials, Printed Circuit Boards (with IPC) and 3D Power Packaging (with PSMA).
Some of his research distinctions include best-paper awards at IEEE Electronic Design and Packaging of Systems (EDAPS 2023); International Microelectronics and Packaging Society Workshop (2023); Oral Presentation Award (3D PEIM 2023), ECTC Student Travel Awards (2022); Nanotechnology, materials and devices conference (NMDC, 2015); ECTC best poster and student paper awards for 2012, 2016, 2019; finalist for best paper at the IEEE Nanotechnology Conference (2014); best student paper and best paper of the session at the International Microelectronics and Packaging Society (IMAPS, 2016); Outstanding Technical Paper Award (IEEE EPTC 2004); Best Poster Award (ECTC 2012); Philips Best Paper Award (ICEPT 2005); IEEE Commendable paper award (2004); Distinguished Scholar Award (Microbeam Analysis Society) in 1998.
He earned his BS (1999) from Indian Institute of Technology, Kanpur, ME (1995) from Indian Institute of Science, Bangalore, and PhD (1999) from Rutgers University, New Jersey. He served as the IEEE Distinguished Lecturer from 2020-2022, and General Chair for 3D Power Electronics Integration and Manufacturing in 2023.
Publications
- S. Y. B. Sayeed, S. B. Venkatakrishnan, J. L. Volakis, and M. R. Pulugurtha, "Miniaturized Fully-Passive Wireless Neural Recording with Heterogeneous Integration in Thin Packages," IEEE Transactions on Components, Packaging and Manufacturing Technology ( Volume: 13, Issue: 3, March 2023), Page(s): 365 - 373, Date of Publication: 08 March 2023, ISSN Information: DOI: 10.1109/TCPMT.2023.3253844
- GSG Al-Duhni, MM Hasan, N Pala, M. R. Pulugurtha, Nanopackaging for FutureG Solutions, IEEE Nanotechnology Magazine, Vol. 18 (Issue 2), 10-20, 2024, DOI: 10.1109/MNANO.2024.3358691
- Sayeed, S.Y.B.; Al Duhni, G.; Navaz, H.V.; Volakis, J.L.; Pulugurtha, M.R. Passive Impedance-Matched Neural Recording Systems for Improved Signal Sensitivity. Sensors 2023, 23, 6441. https://doi.org/10.3390/s23146441
- A. Hassan, S. Soroushiani, A. Abdal, S. Y. B. Sayeed, W.-C. Lin, and M. R. Pulugurtha, "Embedded-Component Planar Fan-Out Packaging for Biophotonic Applications," IEEE Open Journal of Nanotechnology, vol. 3, pp. 52-60, 2022.
- A. O. Watanabe, T.-H. Lin, M. Ali, Y. Wang, V. Smet, M. R. Pulugurtha, et al., "Ultrathin Antenna-Integrated Glass-Based Millimeter-Wave Packages With Through-Glass Vias," IEEE Transactions on Microwave Theory and Techniques, vol. 68, pp. 5082-5092, 2020.